Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

Bibliographic Details
Main Author:	Nagpal, Vijay
Published:	Georgia Institute of Technology 2007
Subjects:	Sealing (Technology) Diffusion bonding (Metals)
Online Access:	http://hdl.handle.net/1853/16450

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