Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum

Bibliographic Details
Main Author: Nagpal, Vijay
Published: Georgia Institute of Technology 2007
Subjects:
Sealing (Technology)
Diffusion bonding (Metals)
Online Access:http://hdl.handle.net/1853/16450
id ndltd-GATECH-oai-smartech.gatech.edu-1853-16450
record_format oai_dc
spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-164502013-12-15T03:35:13ZEffect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuumNagpal, VijaySealing (Technology)Diffusion bonding (Metals)Georgia Institute of Technology2007-08-24T11:33:43Z2007-08-24T11:33:43Z1970-12Thesishttp://hdl.handle.net/1853/16450256513Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Sealing (Technology)
Diffusion bonding (Metals)
spellingShingle Sealing (Technology)
Diffusion bonding (Metals)
Nagpal, Vijay
Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
author Nagpal, Vijay
author_facet Nagpal, Vijay
author_sort Nagpal, Vijay
title Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
title_short Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
title_full Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
title_fullStr Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
title_full_unstemmed Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
title_sort effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuum
publisher Georgia Institute of Technology
publishDate 2007
url http://hdl.handle.net/1853/16450
work_keys_str_mv AT nagpalvijay effectofsurfacecleanlinessonsolidphasebondingofcopperinultrahighvacuum
_version_ 1716618059891867648

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