System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

Bibliographic Details
Main Author:	Liu, Sheng
Published:	Georgia Institute of Technology 2007
Subjects:	Electronic packaging Solder and soldering Lasers in engineering
Online Access:	http://hdl.handle.net/1853/15833

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