Multiwire microstrip interconnects for high-frequency integrated circuit packaging

Multiwire microstrip interconnects for high-frequency integrated circuit packaging

Bibliographic Details
Main Author: Cafaro, Nicholas Giovanni, Jr.
Published: Georgia Institute of Technology 2007
Subjects:
Wire bonding (Electronic packaging)
Microwave circuits
Online Access:http://hdl.handle.net/1853/15454

Internet

http://hdl.handle.net/1853/15454

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