Modeling and simulation of embedded passives using rational functions in multi-layered substrates

Modeling and simulation of embedded passives using rational functions in multi-layered substrates

Bibliographic Details
Main Author:	Choi, Kwang Lim
Published:	Georgia Institute of Technology 2007
Subjects:	Microelectronic packaging Mathematical models Integrated circuits Mathmatical models Microelectronic packaging Materials
Online Access:	http://hdl.handle.net/1853/14858

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