Development of Microelectronics Solder Joint Inspection System: Modal Analysis, Finite Element Modeling, and Ultrasound Signal Processing
Inspection of solder joint interconnection has been a crucial process in the electronics manufacturing industry to reduce manufacturing cost, improve yield, and ensure product quality and reliability. New inspection techniques are urgently needed to fill in the gap between available inspection capab...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1853/11479 |