An Engineering Analysis of Polymer Film Adhesion to Rigid Substrates

An Engineering Analysis of Polymer Film Adhesion to Rigid Substrates

<p>An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich, consisting of a rigid substrate and a viscoelastic encapsulant material, arises from residual stresses. The encapsulant is often deposited on the substrate above its glass transition tempera...

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Bibliographic Details
Main Author: Heymans, Luc J.
Format: Others
Published: 1983
Online Access:https://thesis.library.caltech.edu/1821/1/Heymans_lj_1983.pdf
Heymans, Luc J. (1983) An Engineering Analysis of Polymer Film Adhesion to Rigid Substrates. Dissertation (Ph.D.), California Institute of Technology. doi:10.7907/3GQW-YP87. https://resolver.caltech.edu/CaltechETD:etd-05152007-111322 <https://resolver.caltech.edu/CaltechETD:etd-05152007-111322>

Internet

https://thesis.library.caltech.edu/1821/1/Heymans_lj_1983.pdf
Heymans, Luc J. (1983) An Engineering Analysis of Polymer Film Adhesion to Rigid Substrates. Dissertation (Ph.D.), California Institute of Technology. doi:10.7907/3GQW-YP87. https://resolver.caltech.edu/CaltechETD:etd-05152007-111322 <https://resolver.caltech.edu/CaltechETD:etd-05152007-111322>

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