Monolithic III-V/Si Integration

We summarize our work on creating substrate platforms, processes, and devices for the monolithic integration of silicon CMOS circuits with III-V optical and electronic devices. Visible LEDs and InP HBTs have been integrated on silicon materials platforms that lend themselves to process integration w...

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Bibliographic Details
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE), 2013-09-24T17:53:03Z.
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Summary:We summarize our work on creating substrate platforms, processes, and devices for the monolithic integration of silicon CMOS circuits with III-V optical and electronic devices. Visible LEDs and InP HBTs have been integrated on silicon materials platforms that lend themselves to process integration within silicon fabrication facilities. We also summarize research on tensile Ge, which could be a high mobility material for III-V MOS, and research on an in-situ MOCVD Al[subscript 2]O[subscript 3]/GaAs process for III-V MOS.
United States. Army Research Office
Singapore-MIT Alliance
Microelectronics Advanced Research Corporation (MARCO)
Semiconductor Research Corporation. Interconnect Focus Center
United States. Defense Advanced Research Projects Agency. COSMOS Program