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|a Cai, Yan
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|a MIT Materials Research Laboratory
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|a Massachusetts Institute of Technology. Department of Materials Science and Engineering
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|a Cai, Yan
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|a Camacho-Aguilera, Rodolfo Ernesto
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|a Bessette, Jonathan T.
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|a Kimerling, Lionel C.
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|a Michel, Jurgen
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|a Bessette, Jonathan T.
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|a Kimerling, Lionel C.
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|a Michel, Jurgen
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|a Camacho-Aguilera, Rodolfo Ernesto
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|a High phosphorous doped germanium: Dopant diffusion and modeling
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|b American Institute of Physics (AIP),
|c 2013-07-30T16:46:15Z.
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|z Get fulltext
|u http://hdl.handle.net/1721.1/79725
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|a The in situ n-type doping of Ge thin films epitaxial grown on Si substrates is limited to 1 × 10[superscript 19] cm[superscript −3] by the phosphorous out-diffusion during growth at 600 °C. By studying the phosphorous diffusion in Ge with different background doping, we find that the diffusion coefficient is extrinsic and is enhanced 100 times in Ge doped at 1 × 10[superscript 19] cm[superscript −3] compared to intrinsic diffusivity. To achieve higher phosphorous concentration, delta-doped layers are used as a dopant source for phosphorous in-diffusion. We show that the doping level is a result of the competition between in-diffusion and dopant loss. The high diffusivity at high n-type carrier concentration leads to a uniform distribution of phosphorous in Ge with the concentration above 3 × 10[superscript 19] cm[superscript −3].
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|a United States. Air Force Office of Scientific Research. Multidisciplinary University Research Initiative (Si-Based Laser)
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|a National Science Foundation (U.S.). Graduate Research Fellowship Program
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|a APIC Corporation. Fully LASER Integrated Photonics (FLIP) Program
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|a Naval Air Warfare Center (U.S.). Aircraft Division (OTA N00421-03-9-0002)
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|a en_US
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|a Article
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|t Journal of Applied Physics
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