SI-based unreleased hybrid MEMS-CMOS resonators in 32nm technology

This work presents the first unreleased Silicon resonators fabricated at the transistor level of a standard CMOS process, and realized without any release steps or packaging. These unreleased bulk acoustic resonators are driven capacitively using the thin gate dielectric of the CMOS process, and act...

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Bibliographic Details
Main Authors: Marathe, Radhika A. (Contributor), Wang, Wentao (Contributor), Weinstein, Dana (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor), Massachusetts Institute of Technology. Department of Mechanical Engineering (Contributor)
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE), 2012-10-03T19:11:01Z.
Subjects:
Online Access:Get fulltext
LEADER 02053 am a22002653u 4500
001 73577
042 |a dc 
100 1 0 |a Marathe, Radhika A.  |e author 
100 1 0 |a Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science  |e contributor 
100 1 0 |a Massachusetts Institute of Technology. Department of Mechanical Engineering  |e contributor 
100 1 0 |a Marathe, Radhika A.  |e contributor 
100 1 0 |a Wang, Wentao  |e contributor 
100 1 0 |a Weinstein, Dana  |e contributor 
700 1 0 |a Wang, Wentao  |e author 
700 1 0 |a Weinstein, Dana  |e author 
245 0 0 |a SI-based unreleased hybrid MEMS-CMOS resonators in 32nm technology 
260 |b Institute of Electrical and Electronics Engineers (IEEE),   |c 2012-10-03T19:11:01Z. 
856 |z Get fulltext  |u http://hdl.handle.net/1721.1/73577 
520 |a This work presents the first unreleased Silicon resonators fabricated at the transistor level of a standard CMOS process, and realized without any release steps or packaging. These unreleased bulk acoustic resonators are driven capacitively using the thin gate dielectric of the CMOS process, and actively sensed with a Field Effect Transistor (FET) incorporated into the resonant body. FET sensing using the high f[subscript T], high performance transistors in CMOS amplifies the mechanical signal before the presence of parasitics. This enables RF-MEMS resonators at orders of magnitude higher frequencies than possible with passive devices. First generation CMOS-MEMS Si resonators with Acoustic Bragg Reflectors are demonstrated at 11.1 GHz with Q~17 and a total footprint of 5μm × 3μm using IBM's 32nm SOI technology. 
520 |a United States. Defense Advanced Research Projects Agency. Leading Edge Access Program 
520 |a United States. National Security Agency. Trusted Access Program Office 
520 |a International Business Machines Corporation 
546 |a en_US 
655 7 |a Article 
773 |t Proceedings of the IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS), 2012