3D integration and measurement of a semiconductor double quantum dot with a high-impedance TiN resonator
<jats:title>Abstract</jats:title><jats:p>One major challenge to scaling quantum dot qubits is the dense wiring requirements, making it difficult to envision fabricating large 2D arrays of nearest-neighbor-coupled qubits necessary for error correction. We describe a method to amelio...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Springer Science and Business Media LLC,
2022-07-18T16:39:46Z.
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| Subjects: | |
| Online Access: | Get fulltext |
| Summary: | <jats:title>Abstract</jats:title><jats:p>One major challenge to scaling quantum dot qubits is the dense wiring requirements, making it difficult to envision fabricating large 2D arrays of nearest-neighbor-coupled qubits necessary for error correction. We describe a method to ameliorate this issue by spacing out the qubits using superconducting resonators facilitated by 3D integration. To prove the viability of this approach, we use integration to couple an off-chip high-impedance TiN resonator to a double quantum dot in a Si/SiGe heterostructure. Using the resonator as a dispersive gate sensor, we tune the device down to the single electron regime with an SNR = 5.36. Characterizing the individual systems shows 3D integration can be done while maintaining low-charge noise for the quantum dots and high-quality factors for the superconducting resonator (single photon <jats:italic>Q</jats:italic><jats:sub>L</jats:sub> = 2.14 × 10<jats:sup>4</jats:sup> with <jats:italic>Q</jats:italic><jats:sub>i</jats:sub> ≈ 3 × 10<jats:sup>5</jats:sup>), necessary for readout and high-fidelity two-qubit gates.</jats:p> |
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