Silicon Hard-Stop Spacers for 3D Integration of Superconducting Qubits
© 2019 IEEE. As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is required for accurate prediction of circuit performa...
| Format: | Article |
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| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE),
2021-11-08T14:30:35Z.
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| Subjects: | |
| Online Access: | Get fulltext |