High throughput optical lithography by scanning a massive array of bowtie aperture antennas at near-field

Optical lithography, the enabling process for defining features, has been widely used in semiconductor industry and many other nanotechnology applications. Advances of nanotechnology require developments of high-throughput optical lithography capabilities to overcome the optical diffraction limit an...

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Bibliographic Details
Main Authors: Wen, X. (Author), Datta, A. (Author), Traverso, L. M. (Author), Pan, L. (Author), Xu, X. (Author), Moon, Euclid Eberle (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor)
Format: Article
Language:English
Published: Nature Publishing Group, 2016-01-18T23:01:20Z.
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Summary:Optical lithography, the enabling process for defining features, has been widely used in semiconductor industry and many other nanotechnology applications. Advances of nanotechnology require developments of high-throughput optical lithography capabilities to overcome the optical diffraction limit and meet the ever-decreasing device dimensions. We report our recent experimental advancements to scale up diffraction unlimited optical lithography in a massive scale using the near field nanolithography capabilities of bowtie apertures. A record number of near-field optical elements, an array of 1,024 bowtie antenna apertures, are simultaneously employed to generate a large number of patterns by carefully controlling their working distances over the entire array using an optical gap metrology system. Our experimental results reiterated the ability of using massively-parallel near-field devices to achieve high-throughput optical nanolithography, which can be promising for many important nanotechnology applications such as computation, data storage, communication, and energy.
United States. Defense Advanced Research Projects Agency (Grant N66001-08-1-2037)
National Science Foundation (U.S.) (Grant CMMI-1120577)
National Science Foundation (U.S.) (Grant CMMI-1405078)