Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials,...
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| Format: | Article |
| Language: | English |
| Published: |
Research Management Institute (RMI),
2011.
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| Subjects: | |
| Online Access: | Get fulltext View Fulltext in UiTM IR |