Optimizing The Organic/Inorganic Barrier Structure For Flexible Plastic Substrate Encapsulation

Optimizing The Organic/Inorganic Barrier Structure For Flexible Plastic Substrate Encapsulation

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A multilayered barrier structure stacked with organosilicon and silicon oxide (SiOx) films consecutively prepared using plasma-enhanced chemical vapor deposition (PECVD) was developed to encapsulate flexible plastic substrate. The evolution on the residual internal stress, structural quality of th...

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Bibliographic Details
Main Authors:	Yi-Chiuan Lin, Quoc-Khoa Le, Li-Wei Lai, Ren-Mao Liao, Ming-Shin Jeng, Day-Shan Liu
Format:	Article
Language:	English
Published:	Taiwan Association of Engineering and Technology Innovation 2012-07-01
Series:	International Journal of Engineering and Technology Innovation
Subjects:	Multilayered barrier structure organosilicon/SiOx plasma-enhanced chemical vapor deposition flexible plastic substrate residual internal stress adhesion water vapor transmission rate
Online Access:	http://sparc.nfu.edu.tw/~ijeti/download/V2-no3-184-194.pdf

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