Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low...

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Bibliographic Details
Main Authors: Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2017-06-01
Series:Sensors
Subjects:
packaging
MEMS
EMC
FAM
button shear test
Online Access:http://www.mdpi.com/1424-8220/17/7/1511

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