Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low...

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Main Authors: Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2017-06-01
Series:Sensors
Subjects:
EMC
FAM
Online Access:http://www.mdpi.com/1424-8220/17/7/1511
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spelling doaj-fcd87e8657034018b78a85e12fc127f92020-11-24T23:26:36ZengMDPI AGSensors1424-82202017-06-01177151110.3390/s17071511s17071511Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia SensorsDaniel Hera0Armin Berndt1Thomas Günther2Stephan Schmiel3Christine Harendt4André Zimmermann5Institute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyPackaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS.http://www.mdpi.com/1424-8220/17/7/1511packagingMEMSEMCFAMbutton shear test
collection DOAJ
language English
format Article
sources DOAJ
author Daniel Hera
Armin Berndt
Thomas Günther
Stephan Schmiel
Christine Harendt
André Zimmermann
spellingShingle Daniel Hera
Armin Berndt
Thomas Günther
Stephan Schmiel
Christine Harendt
André Zimmermann
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
Sensors
packaging
MEMS
EMC
FAM
button shear test
author_facet Daniel Hera
Armin Berndt
Thomas Günther
Stephan Schmiel
Christine Harendt
André Zimmermann
author_sort Daniel Hera
title Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
title_short Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
title_full Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
title_fullStr Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
title_full_unstemmed Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
title_sort flexible packaging by film-assisted molding for microintegration of inertia sensors
publisher MDPI AG
series Sensors
issn 1424-8220
publishDate 2017-06-01
description Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS.
topic packaging
MEMS
EMC
FAM
button shear test
url http://www.mdpi.com/1424-8220/17/7/1511
work_keys_str_mv AT danielhera flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
AT arminberndt flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
AT thomasgunther flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
AT stephanschmiel flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
AT christineharendt flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
AT andrezimmermann flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors
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