Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors
Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low...
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doaj-fcd87e8657034018b78a85e12fc127f92020-11-24T23:26:36ZengMDPI AGSensors1424-82202017-06-01177151110.3390/s17071511s17071511Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia SensorsDaniel Hera0Armin Berndt1Thomas Günther2Stephan Schmiel3Christine Harendt4André Zimmermann5Institute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, GermanyInstitute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, GermanyPackaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS.http://www.mdpi.com/1424-8220/17/7/1511packagingMEMSEMCFAMbutton shear test |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Daniel Hera Armin Berndt Thomas Günther Stephan Schmiel Christine Harendt André Zimmermann |
spellingShingle |
Daniel Hera Armin Berndt Thomas Günther Stephan Schmiel Christine Harendt André Zimmermann Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors Sensors packaging MEMS EMC FAM button shear test |
author_facet |
Daniel Hera Armin Berndt Thomas Günther Stephan Schmiel Christine Harendt André Zimmermann |
author_sort |
Daniel Hera |
title |
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors |
title_short |
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors |
title_full |
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors |
title_fullStr |
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors |
title_full_unstemmed |
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors |
title_sort |
flexible packaging by film-assisted molding for microintegration of inertia sensors |
publisher |
MDPI AG |
series |
Sensors |
issn |
1424-8220 |
publishDate |
2017-06-01 |
description |
Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. |
topic |
packaging MEMS EMC FAM button shear test |
url |
http://www.mdpi.com/1424-8220/17/7/1511 |
work_keys_str_mv |
AT danielhera flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors AT arminberndt flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors AT thomasgunther flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors AT stephanschmiel flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors AT christineharendt flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors AT andrezimmermann flexiblepackagingbyfilmassistedmoldingformicrointegrationofinertiasensors |
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1725554286981545984 |