Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator

Abstract Topological insulators (TIs) are recently discovered high‐tech materials where their potential use in nanoelectronic devices such as spintronics and quantum computers, due to their unique electronic features, can be a solution to the emerging need for high‐bit data processing. Yet their mec...

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Main Authors: Utku Uzun, Mehmet Yetmez, Nurgül Akıncı
Format: Article
Language:English
Published: Wiley 2021-03-01
Series:Micro & Nano Letters
Online Access:https://doi.org/10.1049/mna2.12025
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spelling doaj-fc8fb2df1c9843218634a3e82b2584e12021-07-14T13:25:13ZengWileyMicro & Nano Letters1750-04432021-03-0116320321210.1049/mna2.12025Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulatorUtku Uzun0Mehmet Yetmez1Nurgül Akıncı2Department of Mechanical Engineering, Faculty of Engineering Zonguldak Bulent Ecevit University Zonguldak TurkeyDepartment of Mechanical Engineering, Faculty of Engineering Zonguldak Bulent Ecevit University Zonguldak TurkeyDepartment of Physics, Faculty of Arts and Sciences Zonguldak Bulent Ecevit University Zonguldak TurkeyAbstract Topological insulators (TIs) are recently discovered high‐tech materials where their potential use in nanoelectronic devices such as spintronics and quantum computers, due to their unique electronic features, can be a solution to the emerging need for high‐bit data processing. Yet their mechanical properties are not well understood for their use in practical applications. With the objective of exploiting the nanomechanical behaviour of TIs, bulk single‐crystal Bi2Se3 TI is grown by using the Bridgeman–Stockbarger method and mechanically characterised by the nanoindentation method. The Young's modulus and hardness were extracted from the load‐displacement data by using Oliver and Pharr's standard method. Further, fracture toughness of the material was reported for the first time after comprehensive research of indentation crack length (ICL) methods. The grown Bi2Se3 exhibits hardness and Young's modulus as 323 MPa and 6.018 GPa at nanoscale, respectively. Fracture toughness of the TI was evaluated at 0.034 MPa m1/2 and elastic recovery was around 60% after the full unloading process.https://doi.org/10.1049/mna2.12025
collection DOAJ
language English
format Article
sources DOAJ
author Utku Uzun
Mehmet Yetmez
Nurgül Akıncı
spellingShingle Utku Uzun
Mehmet Yetmez
Nurgül Akıncı
Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
Micro & Nano Letters
author_facet Utku Uzun
Mehmet Yetmez
Nurgül Akıncı
author_sort Utku Uzun
title Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
title_short Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
title_full Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
title_fullStr Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
title_full_unstemmed Nanomechanical characterisation of single‐crystal Bi2Se3 topological insulator
title_sort nanomechanical characterisation of single‐crystal bi2se3 topological insulator
publisher Wiley
series Micro & Nano Letters
issn 1750-0443
publishDate 2021-03-01
description Abstract Topological insulators (TIs) are recently discovered high‐tech materials where their potential use in nanoelectronic devices such as spintronics and quantum computers, due to their unique electronic features, can be a solution to the emerging need for high‐bit data processing. Yet their mechanical properties are not well understood for their use in practical applications. With the objective of exploiting the nanomechanical behaviour of TIs, bulk single‐crystal Bi2Se3 TI is grown by using the Bridgeman–Stockbarger method and mechanically characterised by the nanoindentation method. The Young's modulus and hardness were extracted from the load‐displacement data by using Oliver and Pharr's standard method. Further, fracture toughness of the material was reported for the first time after comprehensive research of indentation crack length (ICL) methods. The grown Bi2Se3 exhibits hardness and Young's modulus as 323 MPa and 6.018 GPa at nanoscale, respectively. Fracture toughness of the TI was evaluated at 0.034 MPa m1/2 and elastic recovery was around 60% after the full unloading process.
url https://doi.org/10.1049/mna2.12025
work_keys_str_mv AT utkuuzun nanomechanicalcharacterisationofsinglecrystalbi2se3topologicalinsulator
AT mehmetyetmez nanomechanicalcharacterisationofsinglecrystalbi2se3topologicalinsulator
AT nurgulakıncı nanomechanicalcharacterisationofsinglecrystalbi2se3topologicalinsulator
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