Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process

To realize the connection of copper and Polyphenylene sulfide (PPS) by metal–polymer direct molding, this paper combined anodic oxidation and chemical corrosion to treat the surface of copper, and carried out the injection molding experiment. An orthogonal experimental arrangement was used to identi...

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Main Authors:	Qingsong Cao, Rongsheng Guo, Feng Yang, Jian Rong, Guanghong Hu
Format:	Article
Language:	English
Published:	MDPI AG 2021-05-01
Series:	Materials
Subjects:	surface treatment copper anodic oxidation microstructure injection molding bonding strength
Online Access:	https://www.mdpi.com/1996-1944/14/11/2712

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spelling	doaj-fc3ec172b70f4febbae2871f5b38b6732021-06-01T00:42:18ZengMDPI AGMaterials1996-19442021-05-01142712271210.3390/ma14112712Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding ProcessQingsong Cao0Rongsheng Guo1Feng Yang2Jian Rong3Guanghong Hu4Department of Plasticity Technology, Shanghai Jiao Tong University, Shanghai 200030, ChinaDepartment of Plasticity Technology, Shanghai Jiao Tong University, Shanghai 200030, ChinaDepartment of Plasticity Technology, Shanghai Jiao Tong University, Shanghai 200030, ChinaQingdao Huatao Automobile Mould Co. Ltd., Qingdao 266032, ChinaDepartment of Plasticity Technology, Shanghai Jiao Tong University, Shanghai 200030, ChinaTo realize the connection of copper and Polyphenylene sulfide (PPS) by metal–polymer direct molding, this paper combined anodic oxidation and chemical corrosion to treat the surface of copper, and carried out the injection molding experiment. An orthogonal experimental arrangement was used to identify the optimal electrolyte and etching solution for preparing a microstructure on a copper surface. The bonding and fracture mechanisms of the copper–polymer assembly were investigated through injection molding experiment and SEM technology. The results revealed that the phosphoric acid concentration had the most significant effect on the microstructure quality and etching solution containing 20% phosphoric acid produced a uniform microstructure with 25.77% porosity and 5.52 MPa bonding strength. Meanwhile, SEM images of the interface from bonding to fracture in the copper–polymer assembly indicated a well-filled polymer in the microstructure with a mainly cohesive fracture mode.https://www.mdpi.com/1996-1944/14/11/2712surface treatmentcopperanodic oxidationmicrostructureinjection moldingbonding strength
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Qingsong Cao Rongsheng Guo Feng Yang Jian Rong Guanghong Hu
spellingShingle	Qingsong Cao Rongsheng Guo Feng Yang Jian Rong Guanghong Hu Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process Materials surface treatment copper anodic oxidation microstructure injection molding bonding strength
author_facet	Qingsong Cao Rongsheng Guo Feng Yang Jian Rong Guanghong Hu
author_sort	Qingsong Cao
title	Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process
title_short	Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process
title_full	Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process
title_fullStr	Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process
title_full_unstemmed	Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process
title_sort	research on surface treatment and interfacial bonding technology of copper–polymer direct molding process
publisher	MDPI AG
series	Materials
issn	1996-1944
publishDate	2021-05-01
description	To realize the connection of copper and Polyphenylene sulfide (PPS) by metal–polymer direct molding, this paper combined anodic oxidation and chemical corrosion to treat the surface of copper, and carried out the injection molding experiment. An orthogonal experimental arrangement was used to identify the optimal electrolyte and etching solution for preparing a microstructure on a copper surface. The bonding and fracture mechanisms of the copper–polymer assembly were investigated through injection molding experiment and SEM technology. The results revealed that the phosphoric acid concentration had the most significant effect on the microstructure quality and etching solution containing 20% phosphoric acid produced a uniform microstructure with 25.77% porosity and 5.52 MPa bonding strength. Meanwhile, SEM images of the interface from bonding to fracture in the copper–polymer assembly indicated a well-filled polymer in the microstructure with a mainly cohesive fracture mode.
topic	surface treatment copper anodic oxidation microstructure injection molding bonding strength
url	https://www.mdpi.com/1996-1944/14/11/2712
work_keys_str_mv	AT qingsongcao researchonsurfacetreatmentandinterfacialbondingtechnologyofcopperpolymerdirectmoldingprocess AT rongshengguo researchonsurfacetreatmentandinterfacialbondingtechnologyofcopperpolymerdirectmoldingprocess AT fengyang researchonsurfacetreatmentandinterfacialbondingtechnologyofcopperpolymerdirectmoldingprocess AT jianrong researchonsurfacetreatmentandinterfacialbondingtechnologyofcopperpolymerdirectmoldingprocess AT guanghonghu researchonsurfacetreatmentandinterfacialbondingtechnologyofcopperpolymerdirectmoldingprocess
_version_	1721414189090603008

Research on Surface Treatment and Interfacial Bonding Technology of Copper–Polymer Direct Molding Process

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