Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al<sub>2</sub>O<sub>3</sub> ceramics substrate was studie...
Main Authors: | Wanqin Zhao, Xuesong Mei |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-07-01
|
Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/14/14/3834 |
Similar Items
-
Research on Microhole Processing Technology Based on the Femtosecond-Laser Spiral Trepanning Method
by: Fengping Li, et al.
Published: (2020-10-01) -
An Investigation into Picosecond Laser Micro-Trepanning of Alumina Ceramics Employing a Semi-Water-Immersed Scheme
by: Qiang Ma, et al.
Published: (2019-06-01) -
Cu<sub>2</sub>ZnSnS<sub>4</sub>/Bi<sub>2</sub>FeCrO<sub>6</sub> semiconductor heterojunction grown by pulsed laser deposition and its optoelectronic properties
by: WANG Jie, et al.
Published: (2021-07-01) -
Ablation of BaWO<sub>4</sub> Crystal by Ultrashort Laser Pulses
by: Igor Kinyaevskiy, et al.
Published: (2020-08-01) -
Ultra-Short Pulsed Laser Annealing Effects on MoS<sub>2</sub> Transistors with Asymmetric and Symmetric Contacts
by: Hyeokjin Kwon, et al.
Published: (2019-02-01)