Development of a calibration system for wafer-type temperature sensor

Wafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been...

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Main Authors: Jongho Kim, Jihun Mun, Jae-Soo Shin, Sang-Woo Kang
Format: Article
Language:English
Published: AIP Publishing LLC 2020-11-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/6.0000536
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spelling doaj-f9d05e8061434dc38e391ed7122d490a2020-12-04T12:45:20ZengAIP Publishing LLCAIP Advances2158-32262020-11-011011115108115108-510.1063/6.0000536Development of a calibration system for wafer-type temperature sensorJongho Kim0Jihun Mun1Jae-Soo Shin2Sang-Woo Kang3Semiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaSemiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaDepartment of Advanced Materials Engineering, Daejeon University, 62 Daehak-ro, Daejeon, South KoreaSemiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaWafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been developed according to the process type and temperature range for monitoring the temperature distribution. However, there is little research on the calibration system to ensure the accuracy and reliability of the developed wafer-type temperature sensor. In this study, we designed a system for the calibration of wafer-type temperature sensors. With this system, the traceability of the sensor can be guaranteed by calibrating the sensing characteristics, such as area uniformity, temperature stability, and accuracy. The conventional temperature calibration bath is calibrated by placing a wafer-type temperature sensor in a liquid-controlled system to have uniform temperature. This method is difficult to apply to the field because the wafer-type temperature sensor can be contaminated by liquids and can adversely affect semiconductor processes. For this reason, we used a heating chamber similar to chemical vapor deposition equipment for a calibration system. We evaluated the properties of the calibration system including the rising time (which means the time taken to reach the target temperature) and temperature stability according to the heat capacity. Moreover, we developed a measurement method that allows for the evaluation of the temperature of the wafer-type temperature sensor within 15 min at 150 °C. The calibration system and measurement method developed in this study are expected to improve the efficiency of semiconductor fabrication processes.http://dx.doi.org/10.1063/6.0000536
collection DOAJ
language English
format Article
sources DOAJ
author Jongho Kim
Jihun Mun
Jae-Soo Shin
Sang-Woo Kang
spellingShingle Jongho Kim
Jihun Mun
Jae-Soo Shin
Sang-Woo Kang
Development of a calibration system for wafer-type temperature sensor
AIP Advances
author_facet Jongho Kim
Jihun Mun
Jae-Soo Shin
Sang-Woo Kang
author_sort Jongho Kim
title Development of a calibration system for wafer-type temperature sensor
title_short Development of a calibration system for wafer-type temperature sensor
title_full Development of a calibration system for wafer-type temperature sensor
title_fullStr Development of a calibration system for wafer-type temperature sensor
title_full_unstemmed Development of a calibration system for wafer-type temperature sensor
title_sort development of a calibration system for wafer-type temperature sensor
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2020-11-01
description Wafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been developed according to the process type and temperature range for monitoring the temperature distribution. However, there is little research on the calibration system to ensure the accuracy and reliability of the developed wafer-type temperature sensor. In this study, we designed a system for the calibration of wafer-type temperature sensors. With this system, the traceability of the sensor can be guaranteed by calibrating the sensing characteristics, such as area uniformity, temperature stability, and accuracy. The conventional temperature calibration bath is calibrated by placing a wafer-type temperature sensor in a liquid-controlled system to have uniform temperature. This method is difficult to apply to the field because the wafer-type temperature sensor can be contaminated by liquids and can adversely affect semiconductor processes. For this reason, we used a heating chamber similar to chemical vapor deposition equipment for a calibration system. We evaluated the properties of the calibration system including the rising time (which means the time taken to reach the target temperature) and temperature stability according to the heat capacity. Moreover, we developed a measurement method that allows for the evaluation of the temperature of the wafer-type temperature sensor within 15 min at 150 °C. The calibration system and measurement method developed in this study are expected to improve the efficiency of semiconductor fabrication processes.
url http://dx.doi.org/10.1063/6.0000536
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