Development of a calibration system for wafer-type temperature sensor
Wafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been...
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doaj-f9d05e8061434dc38e391ed7122d490a2020-12-04T12:45:20ZengAIP Publishing LLCAIP Advances2158-32262020-11-011011115108115108-510.1063/6.0000536Development of a calibration system for wafer-type temperature sensorJongho Kim0Jihun Mun1Jae-Soo Shin2Sang-Woo Kang3Semiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaSemiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaDepartment of Advanced Materials Engineering, Daejeon University, 62 Daehak-ro, Daejeon, South KoreaSemiconductor Integrated Metrology Team, Advanced Instrumentation Institute, Korea Research Institute of Standards and Science, 267 Gajeong-ro, Daejeon, South KoreaWafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been developed according to the process type and temperature range for monitoring the temperature distribution. However, there is little research on the calibration system to ensure the accuracy and reliability of the developed wafer-type temperature sensor. In this study, we designed a system for the calibration of wafer-type temperature sensors. With this system, the traceability of the sensor can be guaranteed by calibrating the sensing characteristics, such as area uniformity, temperature stability, and accuracy. The conventional temperature calibration bath is calibrated by placing a wafer-type temperature sensor in a liquid-controlled system to have uniform temperature. This method is difficult to apply to the field because the wafer-type temperature sensor can be contaminated by liquids and can adversely affect semiconductor processes. For this reason, we used a heating chamber similar to chemical vapor deposition equipment for a calibration system. We evaluated the properties of the calibration system including the rising time (which means the time taken to reach the target temperature) and temperature stability according to the heat capacity. Moreover, we developed a measurement method that allows for the evaluation of the temperature of the wafer-type temperature sensor within 15 min at 150 °C. The calibration system and measurement method developed in this study are expected to improve the efficiency of semiconductor fabrication processes.http://dx.doi.org/10.1063/6.0000536 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Jongho Kim Jihun Mun Jae-Soo Shin Sang-Woo Kang |
spellingShingle |
Jongho Kim Jihun Mun Jae-Soo Shin Sang-Woo Kang Development of a calibration system for wafer-type temperature sensor AIP Advances |
author_facet |
Jongho Kim Jihun Mun Jae-Soo Shin Sang-Woo Kang |
author_sort |
Jongho Kim |
title |
Development of a calibration system for wafer-type temperature sensor |
title_short |
Development of a calibration system for wafer-type temperature sensor |
title_full |
Development of a calibration system for wafer-type temperature sensor |
title_fullStr |
Development of a calibration system for wafer-type temperature sensor |
title_full_unstemmed |
Development of a calibration system for wafer-type temperature sensor |
title_sort |
development of a calibration system for wafer-type temperature sensor |
publisher |
AIP Publishing LLC |
series |
AIP Advances |
issn |
2158-3226 |
publishDate |
2020-11-01 |
description |
Wafer-type temperature sensors are widely used during semiconductor fabrication as integrated monitoring sensors for the real-time monitoring of wafer surface temperature, which affects the quality and yield of semiconductor devices. In recent years, various wafer-type temperature sensors have been developed according to the process type and temperature range for monitoring the temperature distribution. However, there is little research on the calibration system to ensure the accuracy and reliability of the developed wafer-type temperature sensor. In this study, we designed a system for the calibration of wafer-type temperature sensors. With this system, the traceability of the sensor can be guaranteed by calibrating the sensing characteristics, such as area uniformity, temperature stability, and accuracy. The conventional temperature calibration bath is calibrated by placing a wafer-type temperature sensor in a liquid-controlled system to have uniform temperature. This method is difficult to apply to the field because the wafer-type temperature sensor can be contaminated by liquids and can adversely affect semiconductor processes. For this reason, we used a heating chamber similar to chemical vapor deposition equipment for a calibration system. We evaluated the properties of the calibration system including the rising time (which means the time taken to reach the target temperature) and temperature stability according to the heat capacity. Moreover, we developed a measurement method that allows for the evaluation of the temperature of the wafer-type temperature sensor within 15 min at 150 °C. The calibration system and measurement method developed in this study are expected to improve the efficiency of semiconductor fabrication processes. |
url |
http://dx.doi.org/10.1063/6.0000536 |
work_keys_str_mv |
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