Small Footprint Multilayered Millimeter-Wave Antennas and Feeding Networks for Multi-Dimensional Scanning and High-Density Integrated Systems

• Main Authors: T. Djerafi, N. Ghassemi, O. Kramer, B. Youzkateli-el-Khatib, A. B. Guntupalli, K. Wu
• Format: Article
• Language: English
• Published: Spolecnost pro radioelektronicke inzenyrstvi 2012-12-01
• Series: Radioengineering
• Subjects: Beamforming; corner; horn millimeter-wave antenna and array; multi-dimensional scanning; patch; six-port; slot; Substrate Integrated Waveguide (SIW); Yagi
• Online Access: http://www.radioeng.cz/fulltexts/2012/12_04_0935_0945.pdf

This paper overviews the state-of-the-art of substrate integrated waveguide (SIW) techniques in the design and realization of innovative low-cost, low-profile and low-loss (L3) millimeter-wave antenna elements, feeding networks and arrays for various wireless applications. Novel classes of multilayered antenna structures and sys-tems are proposed and studied to exploit the vertical di-mension of planar structures to overcome certain limita-tions in standard two-dimensional (2-D) topologies. The developed structures are based on two techniques, namely multi-layer stacked structures and E-plane corners. Differ-ent E-plane structures realised with SIW waveguide are presented, thereby demonstrating the potential of the proposed techniques as in multi-polarization antenna feeding. An array of 128 elements shows low SLL and height gain with just 200g of the total weight. Two versions of 2-D scanning multi-beam are presented, which effectively combine frequency scanning with beam forming networks. Adding the benefits of wide band performance to the multilayer structure, two bi-layer structures are investigated. Different stacked antennas and arrays are demonstrated to optimise the targeted antenna performances in the smallest footprint possible. These structures meet the requirement for developing inexpensive compact millimeter-wave antennas and antenna systems. Different structures and architectures are theoretically and experimentally studied and discussed for specific space- and ground-based appli-cations. Practical issues such as high-density integration and high-volume manufacturability are also addressed.