The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cross-sectioned microstructure image, the real-time synchrotron r...

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Bibliographic Details
Main Authors: M.I.I. Ramli, M.A.A. Mohd Salleh, H. Yasuda, J. Chaiprapa, K. Nogita
Format: Article
Language:English
Published: Elsevier 2020-01-01
Series:Materials & Design
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127519307191

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