The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

• Main Authors: M.I.I. Ramli, M.A.A. Mohd Salleh, H. Yasuda, J. Chaiprapa, K. Nogita
• Format: Article
• Language: English
• Published: Elsevier 2020-01-01
• Series: Materials & Design
• Online Access: http://www.sciencedirect.com/science/article/pii/S0264127519307191

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cross-sectioned microstructure image, the real-time synchrotron radiation imaging and synchrotron micro-X-ray fluorescence (XRF) technique was also used to investigate the microstructure, focusing on the in-situ growth behaviour of the primary (Cu,Ni)6Sn5 intermetallic and elemental distribution that had occurred in the Sn-0.7Cu-0.05Ni-1.5Bi. Other essential properties of solder material, such as wettability, electrical resistance, and shear strength, were also determined. The results showed that the addition of 1.5 wt% Bi refined the primary (Cu,Ni)6Sn5 intermetallics formation in the solder joint, where it grew earlier and faster relative to that in the Sn-0.7Cu-0.05Ni/Cu joint. Additionally, the addition of 1.5 wt% Bi resulted with a 3% reduction of its electrical resistance while increasing the wettability of the solder alloy. 1.5 wt% addition of the Bi element also found to have contributed to a significant increment of shear strength relative to that of the Sn-0.7Cu-0.05Ni. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications. Keywords: Soldering, Solder, Interconnects, Intermetallics, Solid solution, Microstructure, Solder properties