Co‐packaged datacenter optics: Opportunities and challenges
Abstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to...
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2021-04-01
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Online Access: | https://doi.org/10.1049/ote2.12020 |
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doaj-f85021eed0264d7385437fcad4b303f82021-08-02T08:20:31ZengWileyIET Optoelectronics1751-87681751-87762021-04-01152779110.1049/ote2.12020Co‐packaged datacenter optics: Opportunities and challengesCyriel Minkenberg0Rajagopal Krishnaswamy1Aaron Zilkie2David Nelson3Rockley Photonics Ltd. 57 Woodstock Road OxfordOX2 6HJ UKRockley Photonics Inc. San Jose CARockley Photonics Inc. Pasadena CARockley Photonics Inc. Pasadena CAAbstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.https://doi.org/10.1049/ote2.12020 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Cyriel Minkenberg Rajagopal Krishnaswamy Aaron Zilkie David Nelson |
spellingShingle |
Cyriel Minkenberg Rajagopal Krishnaswamy Aaron Zilkie David Nelson Co‐packaged datacenter optics: Opportunities and challenges IET Optoelectronics |
author_facet |
Cyriel Minkenberg Rajagopal Krishnaswamy Aaron Zilkie David Nelson |
author_sort |
Cyriel Minkenberg |
title |
Co‐packaged datacenter optics: Opportunities and challenges |
title_short |
Co‐packaged datacenter optics: Opportunities and challenges |
title_full |
Co‐packaged datacenter optics: Opportunities and challenges |
title_fullStr |
Co‐packaged datacenter optics: Opportunities and challenges |
title_full_unstemmed |
Co‐packaged datacenter optics: Opportunities and challenges |
title_sort |
co‐packaged datacenter optics: opportunities and challenges |
publisher |
Wiley |
series |
IET Optoelectronics |
issn |
1751-8768 1751-8776 |
publishDate |
2021-04-01 |
description |
Abstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture. |
url |
https://doi.org/10.1049/ote2.12020 |
work_keys_str_mv |
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_version_ |
1721238555819245568 |