Co‐packaged datacenter optics: Opportunities and challenges

Abstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to...

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Main Authors: Cyriel Minkenberg, Rajagopal Krishnaswamy, Aaron Zilkie, David Nelson
Format: Article
Language:English
Published: Wiley 2021-04-01
Series:IET Optoelectronics
Online Access:https://doi.org/10.1049/ote2.12020
id doaj-f85021eed0264d7385437fcad4b303f8
record_format Article
spelling doaj-f85021eed0264d7385437fcad4b303f82021-08-02T08:20:31ZengWileyIET Optoelectronics1751-87681751-87762021-04-01152779110.1049/ote2.12020Co‐packaged datacenter optics: Opportunities and challengesCyriel Minkenberg0Rajagopal Krishnaswamy1Aaron Zilkie2David Nelson3Rockley Photonics Ltd. 57 Woodstock Road OxfordOX2 6HJ UKRockley Photonics Inc. San Jose CARockley Photonics Inc. Pasadena CARockley Photonics Inc. Pasadena CAAbstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.https://doi.org/10.1049/ote2.12020
collection DOAJ
language English
format Article
sources DOAJ
author Cyriel Minkenberg
Rajagopal Krishnaswamy
Aaron Zilkie
David Nelson
spellingShingle Cyriel Minkenberg
Rajagopal Krishnaswamy
Aaron Zilkie
David Nelson
Co‐packaged datacenter optics: Opportunities and challenges
IET Optoelectronics
author_facet Cyriel Minkenberg
Rajagopal Krishnaswamy
Aaron Zilkie
David Nelson
author_sort Cyriel Minkenberg
title Co‐packaged datacenter optics: Opportunities and challenges
title_short Co‐packaged datacenter optics: Opportunities and challenges
title_full Co‐packaged datacenter optics: Opportunities and challenges
title_fullStr Co‐packaged datacenter optics: Opportunities and challenges
title_full_unstemmed Co‐packaged datacenter optics: Opportunities and challenges
title_sort co‐packaged datacenter optics: opportunities and challenges
publisher Wiley
series IET Optoelectronics
issn 1751-8768
1751-8776
publishDate 2021-04-01
description Abstract High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.
url https://doi.org/10.1049/ote2.12020
work_keys_str_mv AT cyrielminkenberg copackageddatacenteropticsopportunitiesandchallenges
AT rajagopalkrishnaswamy copackageddatacenteropticsopportunitiesandchallenges
AT aaronzilkie copackageddatacenteropticsopportunitiesandchallenges
AT davidnelson copackageddatacenteropticsopportunitiesandchallenges
_version_ 1721238555819245568