Growth simulation of Cu columnar structures under oblique angle deposition and Monte Carlo random walks
In this simulation model, oblique angle deposition method and Monte Carlo random walks have been used. Growth model was ballistic deposition (BD). Incident particles flux comes to substrate at an angle with respect to normal. Two physical factors including self-shadowing and mobility limitation of i...
Main Authors: | R S Dariani, S Kadivian Azar |
---|---|
Format: | Article |
Language: | English |
Published: |
Isfahan University of Technology
2013-10-01
|
Series: | Iranian Journal of Physics Research |
Subjects: | |
Online Access: | http://ijpr.iut.ac.ir/browse.php?a_code=A-10-1130-3&slc_lang=en&sid=1 |
Similar Items
-
Correlation between porosity and roughness as obtained by porous silicon nano surface scattering spectrum
by: R Dariani, et al.
Published: (2015-01-01) -
Comparative study of sculptured metallic thin films deposited by oblique angle deposition at different temperatures
by: Susann Liedtke, et al.
Published: (2018-03-01) -
Surface shadowing’s effects on the scattering from rough surfaces
by: F Salehi, et al.
Published: (2012-09-01) -
Rough-Fuzzy Clustering Based on Two-Stage Three-Way Approximations
by: Jie Zhou, et al.
Published: (2018-01-01) -
Morphological Characteristics of Au Films Deposited on Ti: A Combined SEM-AFM Study
by: Francesco Ruffino, et al.
Published: (2018-03-01)