Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies

We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using var...

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Bibliographic Details
Main Authors: Zhijing Zhu, Chuanyun Yi, Tielin Shi, Yichun Zhang, Yang Gao, Guanglan Liao
Format: Article
Language:English
Published: Hindawi Limited 2015-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2015/179714

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