Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies

Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies

We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using var...

Full description

Bibliographic Details
Main Authors: Zhijing Zhu, Chuanyun Yi, Tielin Shi, Yichun Zhang, Yang Gao, Guanglan Liao
Format: Article
Language:English
Published: Hindawi Limited 2015-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2015/179714
id doaj-f45a077bf4074089b9a1df10244d390b
record_format Article
spelling doaj-f45a077bf4074089b9a1df10244d390b2020-11-24T21:18:05ZengHindawi LimitedAdvances in Materials Science and Engineering1687-84341687-84422015-01-01201510.1155/2015/179714179714Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon DiesZhijing Zhu0Chuanyun Yi1Tielin Shi2Yichun Zhang3Yang Gao4Guanglan Liao5State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, ChinaJiangxi Province Key Laboratory of Numerical Control Technology and Application, Jiujiang 332005, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, ChinaWe demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using varying load mode (100 N for 60 s and then 400 N for 60 s) compared with using constant load mode (200 N for 120 s). A micropart with good appearance was fabricated under the varying load, and no silicon die failure was observed, in agreement with the simulation. The amorphous state of the micropart was confirmed by differential scanning calorimeter and X-ray diffraction, and the nanohardness and Young’s modulus were validated close to those of the as-cast BMG rods by nanoindentation tests. The results proved that it was feasible to adopt the varying load mode to fabricate three-dimensional Zr-based bulk metallic glass microparts by hot embossing process.http://dx.doi.org/10.1155/2015/179714
collection DOAJ
language English
format Article
sources DOAJ
author Zhijing Zhu
Chuanyun Yi
Tielin Shi
Yichun Zhang
Yang Gao
Guanglan Liao
spellingShingle Zhijing Zhu
Chuanyun Yi
Tielin Shi
Yichun Zhang
Yang Gao
Guanglan Liao
Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
Advances in Materials Science and Engineering
author_facet Zhijing Zhu
Chuanyun Yi
Tielin Shi
Yichun Zhang
Yang Gao
Guanglan Liao
author_sort Zhijing Zhu
title Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
title_short Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
title_full Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
title_fullStr Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
title_full_unstemmed Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies
title_sort hot embossing of zr-based bulk metallic glass micropart using stacked silicon dies
publisher Hindawi Limited
series Advances in Materials Science and Engineering
issn 1687-8434
1687-8442
publishDate 2015-01-01
description We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using varying load mode (100 N for 60 s and then 400 N for 60 s) compared with using constant load mode (200 N for 120 s). A micropart with good appearance was fabricated under the varying load, and no silicon die failure was observed, in agreement with the simulation. The amorphous state of the micropart was confirmed by differential scanning calorimeter and X-ray diffraction, and the nanohardness and Young’s modulus were validated close to those of the as-cast BMG rods by nanoindentation tests. The results proved that it was feasible to adopt the varying load mode to fabricate three-dimensional Zr-based bulk metallic glass microparts by hot embossing process.
url http://dx.doi.org/10.1155/2015/179714
work_keys_str_mv AT zhijingzhu hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
AT chuanyunyi hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
AT tielinshi hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
AT yichunzhang hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
AT yanggao hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
AT guanglanliao hotembossingofzrbasedbulkmetallicglassmicropartusingstackedsilicondies
_version_ 1726010433343586304

Similar Items