Hot Embossing of Zr-Based Bulk Metallic Glass Micropart Using Stacked Silicon Dies

We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using var...

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Bibliographic Details
Main Authors: Zhijing Zhu, Chuanyun Yi, Tielin Shi, Yichun Zhang, Yang Gao, Guanglan Liao
Format: Article
Language:English
Published: Hindawi Limited 2015-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2015/179714
Description
Summary:We demonstrated hot embossing of Zr65Cu17.5Ni10Al7.5 bulk metallic glass micropart using stacked silicon dies. Finite element simulation was carried out, suggesting that it could reduce the stress below 400 MPa in the silicon dies and enhance the durability of the brittle silicon dies when using varying load mode (100 N for 60 s and then 400 N for 60 s) compared with using constant load mode (200 N for 120 s). A micropart with good appearance was fabricated under the varying load, and no silicon die failure was observed, in agreement with the simulation. The amorphous state of the micropart was confirmed by differential scanning calorimeter and X-ray diffraction, and the nanohardness and Young’s modulus were validated close to those of the as-cast BMG rods by nanoindentation tests. The results proved that it was feasible to adopt the varying load mode to fabricate three-dimensional Zr-based bulk metallic glass microparts by hot embossing process.
ISSN:1687-8434
1687-8442