Recovery of Metal Values from Useless Printed Circuit Boards

This study provides a hydrometallurgical method to recover copper, lead, tin and gold from useless printed circuit boards. Metals in the board were leached with different mineral acids. Gold, if present, was first recovered by filtering from the acid solution, washed and polished. Metal salts went i...

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Main Authors: Mahmoud Rabah, Mahmoud Mosa, Gehan M. Aly
Format: Article
Language:English
Published: al-Farabi Kazakh National University 2007-03-01
Series:Eurasian Chemico-Technological Journal 
Online Access:http://ect-journal.kz/index.php/ectj/article/view/658
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spelling doaj-f2545e4c62624d5a993ded764edfad6b2020-11-25T00:27:37Zengal-Farabi Kazakh National UniversityEurasian Chemico-Technological Journal 1562-39202522-48672007-03-019212913710.18321/ectj264658Recovery of Metal Values from Useless Printed Circuit BoardsMahmoud RabahMahmoud MosaGehan M. AlyThis study provides a hydrometallurgical method to recover copper, lead, tin and gold from useless printed circuit boards. Metals in the board were leached with different mineral acids. Gold, if present, was first recovered by filtering from the acid solution, washed and polished. Metal salts went into the acidic leachant were separately recovered, washed and dried. These were thermally reduced using carbon to obtain reduced metals. The polymeric base material was found safe for feasible for reuse in the manufacture of new printed circuit boards. Parameters affecting the recovery factor were studied. Results obtained showed that nitric acid was more effective compared to sulfuric or hydrochloric acid. The extent of metals dissolution increases with increase in acid molarity, stoichiometric ratio, temperature and time of leaching. With sulfuric acid, copper dissolved in > 6 M solution at > 75 °C whereas lead and tin did not. With nitric acid, all metals dissolved on hot conditions whereby tin deposited upon cooling as basic oxide. Lead was separated from copper as chloride. Copper was separated as solid sulfide. The recovered compounds were reduced with hydrogen gas or by carbon at temperatures up to 1000 °C. A separation factor of 98.4-96.2% was achieved.http://ect-journal.kz/index.php/ectj/article/view/658
collection DOAJ
language English
format Article
sources DOAJ
author Mahmoud Rabah
Mahmoud Mosa
Gehan M. Aly
spellingShingle Mahmoud Rabah
Mahmoud Mosa
Gehan M. Aly
Recovery of Metal Values from Useless Printed Circuit Boards
Eurasian Chemico-Technological Journal 
author_facet Mahmoud Rabah
Mahmoud Mosa
Gehan M. Aly
author_sort Mahmoud Rabah
title Recovery of Metal Values from Useless Printed Circuit Boards
title_short Recovery of Metal Values from Useless Printed Circuit Boards
title_full Recovery of Metal Values from Useless Printed Circuit Boards
title_fullStr Recovery of Metal Values from Useless Printed Circuit Boards
title_full_unstemmed Recovery of Metal Values from Useless Printed Circuit Boards
title_sort recovery of metal values from useless printed circuit boards
publisher al-Farabi Kazakh National University
series Eurasian Chemico-Technological Journal 
issn 1562-3920
2522-4867
publishDate 2007-03-01
description This study provides a hydrometallurgical method to recover copper, lead, tin and gold from useless printed circuit boards. Metals in the board were leached with different mineral acids. Gold, if present, was first recovered by filtering from the acid solution, washed and polished. Metal salts went into the acidic leachant were separately recovered, washed and dried. These were thermally reduced using carbon to obtain reduced metals. The polymeric base material was found safe for feasible for reuse in the manufacture of new printed circuit boards. Parameters affecting the recovery factor were studied. Results obtained showed that nitric acid was more effective compared to sulfuric or hydrochloric acid. The extent of metals dissolution increases with increase in acid molarity, stoichiometric ratio, temperature and time of leaching. With sulfuric acid, copper dissolved in > 6 M solution at > 75 °C whereas lead and tin did not. With nitric acid, all metals dissolved on hot conditions whereby tin deposited upon cooling as basic oxide. Lead was separated from copper as chloride. Copper was separated as solid sulfide. The recovered compounds were reduced with hydrogen gas or by carbon at temperatures up to 1000 °C. A separation factor of 98.4-96.2% was achieved.
url http://ect-journal.kz/index.php/ectj/article/view/658
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