Cure Kinetics and TTT-diagram of Toughed Bismaleimide Resin with Double-heating Wave Reaction Characteristics

• Main Authors: ZHANG Chen-qian, CHEN Wei, YE Hong-jun, GUAN Zhi-dong, LI Zeng-shan
• Format: Article
• Language: zho
• Published: Journal of Materials Engineering 2016-10-01
• Series: Journal of Materials Engineering
• Subjects: toughed bismaleimide resin; 5429 resin; cure kinetics; glass transition temperature; time-temperature-transition diagram
• Online Access: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.10.003
• ISSN: 1001-4381; 1001-4381

The phenomenological model of 5429 resin was established by cure kinetic parameters of the bismaleimide (5429) with double-heating wave reaction characteristics gained by dynamic DSC analysis combining with the phenomenological model. Also, based on the DSC experimental data of 5429 resins at 180℃ with different heating time, the relationship between curing degree and heating time of 5429 resin was investigated with DiBenedetto equation under isothermal condition, and the equation of glass transition temperature and curing time were obtained. The gel time of 5429 resin was gained at different time by gelation disk. The functional relationship between conversion at gelation and glass transition temperature of 5429 resin was also obtained. Then, the time-temperature-transition (TTT) diagram was presented based on the above results. The optimum curing curve of 5429 resin concluded from TTT diagram is consistent with the standard curing curve.