Microscopic study of stress effects around micro-crack tips using a non-contact stress-induced light scattering method
Fine-polishing techniques may cause micro-cracks under glass substrate surfaces. According to highly requirement from production field, a thermal stress-induced light scattering method (T-SILSM) was successfully developed for a non-contact inspection to detect the micro-cracks through changing in th...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2016-09-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4963673 |