4H-SiC N-Channel JFET for Operation in High-Temperature Environments

Lateral depletion-mode 4H-SiC n-channel junction field-effect transistors (JFETs) are demonstrated to operate with well-behaved electrical characteristics at temperatures up to 600°C in air. Ti/Ni/TiW metal stacks are used to form ohmic contacts to n-type 4H-SiC with specific contact resi...

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Main Authors: Wei-Chen Lien, Nattapol Damrongplasit, John H. Paredes, Debbie G. Senesky, Tsu-Jae K. Liu, Albert P. Pisano
Format: Article
Language:English
Published: IEEE 2014-01-01
Series:IEEE Journal of the Electron Devices Society
Online Access:https://ieeexplore.ieee.org/document/6892931/
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spelling doaj-ec0cee0a0010495e94845a0350195f4b2021-03-29T18:42:32ZengIEEEIEEE Journal of the Electron Devices Society2168-67342014-01-012616416710.1109/JEDS.2014.235513268929314H-SiC N-Channel JFET for Operation in High-Temperature EnvironmentsWei-Chen Lien0Nattapol Damrongplasit1John H. Paredes2Debbie G. Senesky3Tsu-Jae K. Liu4Albert P. Pisano5Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USADepartment of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USADepartment of Materials Science and Engineering, University of California, Merced, Merced, CA, USADepartment of Aeronautics and Astronautics, Stanford University, Stanford, CA, USADepartment of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USADepartment of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USALateral depletion-mode 4H-SiC n-channel junction field-effect transistors (JFETs) are demonstrated to operate with well-behaved electrical characteristics at temperatures up to 600&#x00B0;C in air. Ti/Ni/TiW metal stacks are used to form ohmic contacts to n-type 4H-SiC with specific contact resistance of 1.14 &#x00D7; 10<sup>-3</sup> &#x03A9; cm<sup>2</sup> at 600&#x00B0;C. The on/off drain saturation current ratio and intrinsic gain at 600&#x00B0;C are 1.53 &#x00D7; 10<sup>3</sup> and 57.2, respectively. These results indicate that 4H-SiC JFETs can be used for extremely-high-temperature electronics applications.https://ieeexplore.ieee.org/document/6892931/
collection DOAJ
language English
format Article
sources DOAJ
author Wei-Chen Lien
Nattapol Damrongplasit
John H. Paredes
Debbie G. Senesky
Tsu-Jae K. Liu
Albert P. Pisano
spellingShingle Wei-Chen Lien
Nattapol Damrongplasit
John H. Paredes
Debbie G. Senesky
Tsu-Jae K. Liu
Albert P. Pisano
4H-SiC N-Channel JFET for Operation in High-Temperature Environments
IEEE Journal of the Electron Devices Society
author_facet Wei-Chen Lien
Nattapol Damrongplasit
John H. Paredes
Debbie G. Senesky
Tsu-Jae K. Liu
Albert P. Pisano
author_sort Wei-Chen Lien
title 4H-SiC N-Channel JFET for Operation in High-Temperature Environments
title_short 4H-SiC N-Channel JFET for Operation in High-Temperature Environments
title_full 4H-SiC N-Channel JFET for Operation in High-Temperature Environments
title_fullStr 4H-SiC N-Channel JFET for Operation in High-Temperature Environments
title_full_unstemmed 4H-SiC N-Channel JFET for Operation in High-Temperature Environments
title_sort 4h-sic n-channel jfet for operation in high-temperature environments
publisher IEEE
series IEEE Journal of the Electron Devices Society
issn 2168-6734
publishDate 2014-01-01
description Lateral depletion-mode 4H-SiC n-channel junction field-effect transistors (JFETs) are demonstrated to operate with well-behaved electrical characteristics at temperatures up to 600&#x00B0;C in air. Ti/Ni/TiW metal stacks are used to form ohmic contacts to n-type 4H-SiC with specific contact resistance of 1.14 &#x00D7; 10<sup>-3</sup> &#x03A9; cm<sup>2</sup> at 600&#x00B0;C. The on/off drain saturation current ratio and intrinsic gain at 600&#x00B0;C are 1.53 &#x00D7; 10<sup>3</sup> and 57.2, respectively. These results indicate that 4H-SiC JFETs can be used for extremely-high-temperature electronics applications.
url https://ieeexplore.ieee.org/document/6892931/
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