Sub-Picosecond Micromachining of Monocrystalline Silicon for Solar Cell Manufacturing
In this study a prototype sub-picosecond laser was investigated for cutting and scribing of silicon wafers. The Yb:KYW laser used for this investigation, unlike ultrashort systems used previously, generates pulses of 650 fs, i.e., between the pico and femtosecond range. The laser was placed in a mic...
Main Authors: | Katarzyna Garasz, Marek Kocik |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-10-01
|
Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/10/20/7277 |
Similar Items
-
Experimental Investigations on Laser Ablation of Aluminum in Sub-Picosecond Regimes
by: Katarzyna Garasz, et al.
Published: (2020-12-01) -
Experimental Study on Fabrication of CVD Diamond Micro Milling Tool by Picosecond Pulsed Laser
by: Yi Xia, et al.
Published: (2021-08-01) -
Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
by: Mingwei Lei, et al.
Published: (2019-12-01) -
Green Picosecond Laser Machining of Thermoset and Thermoplastic Carbon Fiber Reinforced Polymers
by: Insung Choi, et al.
Published: (2021-02-01) -
Picosecond optical studies of semiconductor dynamics /
by: McLean, Daniel Garth
Published: (1984)