Low-Cost Microbolometer Type Infrared Detectors

The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMO...

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Main Authors:	Le Yu, Yaozu Guo, Haoyu Zhu, Mingcheng Luo, Ping Han, Xiaoli Ji
Format:	Article
Language:	English
Published:	MDPI AG 2020-08-01
Series:	Micromachines
Subjects:	microbolometer complementary metal oxide semiconductor (CMOS)-compatible uncooled infrared detectors thermal detectors infrared focal plane array (IRFPA) read-out integrated circuit (ROIC)
Online Access:	https://www.mdpi.com/2072-666X/11/9/800

id	doaj-e9e32d52afe245039f6c256d4d846224
record_format	Article
spelling	doaj-e9e32d52afe245039f6c256d4d8462242020-11-25T03:42:44ZengMDPI AGMicromachines2072-666X2020-08-011180080010.3390/mi11090800Low-Cost Microbolometer Type Infrared DetectorsLe Yu0Yaozu Guo1Haoyu Zhu2Mingcheng Luo3Ping Han4Xiaoli Ji5School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaSchool of Electronic Science and Engineering, Nanjing University, Nanjing 210093, ChinaThe complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.https://www.mdpi.com/2072-666X/11/9/800microbolometercomplementary metal oxide semiconductor (CMOS)-compatibleuncooled infrared detectorsthermal detectorsinfrared focal plane array (IRFPA)read-out integrated circuit (ROIC)
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Le Yu Yaozu Guo Haoyu Zhu Mingcheng Luo Ping Han Xiaoli Ji
spellingShingle	Le Yu Yaozu Guo Haoyu Zhu Mingcheng Luo Ping Han Xiaoli Ji Low-Cost Microbolometer Type Infrared Detectors Micromachines microbolometer complementary metal oxide semiconductor (CMOS)-compatible uncooled infrared detectors thermal detectors infrared focal plane array (IRFPA) read-out integrated circuit (ROIC)
author_facet	Le Yu Yaozu Guo Haoyu Zhu Mingcheng Luo Ping Han Xiaoli Ji
author_sort	Le Yu
title	Low-Cost Microbolometer Type Infrared Detectors
title_short	Low-Cost Microbolometer Type Infrared Detectors
title_full	Low-Cost Microbolometer Type Infrared Detectors
title_fullStr	Low-Cost Microbolometer Type Infrared Detectors
title_full_unstemmed	Low-Cost Microbolometer Type Infrared Detectors
title_sort	low-cost microbolometer type infrared detectors
publisher	MDPI AG
series	Micromachines
issn	2072-666X
publishDate	2020-08-01
description	The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.
topic	microbolometer complementary metal oxide semiconductor (CMOS)-compatible uncooled infrared detectors thermal detectors infrared focal plane array (IRFPA) read-out integrated circuit (ROIC)
url	https://www.mdpi.com/2072-666X/11/9/800
work_keys_str_mv	AT leyu lowcostmicrobolometertypeinfrareddetectors AT yaozuguo lowcostmicrobolometertypeinfrareddetectors AT haoyuzhu lowcostmicrobolometertypeinfrareddetectors AT mingchengluo lowcostmicrobolometertypeinfrareddetectors AT pinghan lowcostmicrobolometertypeinfrareddetectors AT xiaoliji lowcostmicrobolometertypeinfrareddetectors
_version_	1724523852278530048

Low-Cost Microbolometer Type Infrared Detectors

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