Presintered Titanium-Hydroxyapatite Composite Fabricated via PIM Route

Ti6Al4V-HA composites have been recognized for their potential for biomedical implantation purposes. In the present study, Ti6Al4V-HA composites were fabricated by Powder Injection Molding (PIM) route. Ti6Al4V-HA feedstock at a ratio of 87:13 vol.% was prepared by using a binder system consisting of...

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Bibliographic Details
Main Authors: Nurul Nadiah Mahmud, Abu Bakar Sulong, Bhupendra Sharma, Kei Ameyama
Format: Article
Language:English
Published: MDPI AG 2021-02-01
Series:Metals
Subjects:
Online Access:https://www.mdpi.com/2075-4701/11/2/318
Description
Summary:Ti6Al4V-HA composites have been recognized for their potential for biomedical implantation purposes. In the present study, Ti6Al4V-HA composites were fabricated by Powder Injection Molding (PIM) route. Ti6Al4V-HA feedstock at a ratio of 87:13 vol.% was prepared by using a binder system consisting of palm stearin (PS) and polyethylene (PE). The Critical Powder Volume Percentage (CPVP) value for Ti6Al4V-HA was 68 vol.%. Ti6Al4V-HA feedstock was developed at 66 vol.% powder loading. Ti6Al4V-HA feedstock showed pseudoplastic behaviour with a low viscosity and low activation energy of flow and was successfully injected into a tensile bar shape. The debinding process involved a solvent and thermal debinding operation. The debonded parts were sintered at 1300 °C, and the influence of the presintering stage on the physical and mechanical properties of the sintered parts was investigated. It was proven that the presintering stage was able to restrain the transformation of Ti6Al4V into Ti<sub>3</sub>Al (α<sub>2</sub>) as well as the decomposition of HA. These are key findings ideas for the designing of sintering parameters, where the decomposition of HA becoming the main problem in the sintering of Ti6Al4V-HA composites at a high temperature. The obtained results also showed that the sintered parts had a porous structure, which looked promising for their use in biomedical implantations. purposes.
ISSN:2075-4701