2.5D package interposer automatic design based on Allegro Package Design

2.5D package interposer automatic design based on Allegro Package Design

Due to the high bandwidth characteristics of HBM(high bandwidth memory), there are a large number of HBM interface connections that need to be manually completed during the layout design of the 2.5D package interposer. This article describes how to use the SKILL language to implement automatic wirin...

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Bibliographic Details
Main Authors: Zhang Cheng, Tan Lingyan, Zeng Lingyue
Format: Article
Language:zho
Published: National Computer System Engineering Research Institute of China 2019-08-01
Series:Dianzi Jishu Yingyong
Subjects:
2.5d advanced package
hbm(high bandwidth memory)
skill
apd(allegro package design)
automatic wiring
Online Access:http://www.chinaaet.com/article/3000107423

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