2.5D package interposer automatic design based on Allegro Package Design

Due to the high bandwidth characteristics of HBM(high bandwidth memory), there are a large number of HBM interface connections that need to be manually completed during the layout design of the 2.5D package interposer. This article describes how to use the SKILL language to implement automatic wirin...

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Bibliographic Details
Main Authors:	Zhang Cheng, Tan Lingyan, Zeng Lingyue
Format:	Article
Language:	zho
Published:	National Computer System Engineering Research Institute of China 2019-08-01
Series:	Dianzi Jishu Yingyong
Subjects:	2.5d advanced package hbm(high bandwidth memory) skill apd(allegro package design) automatic wiring
Online Access:	http://www.chinaaet.com/article/3000107423

id	doaj-e391be172a084adcb964fc938cd403aa
record_format	Article
spelling	doaj-e391be172a084adcb964fc938cd403aa2020-11-25T01:32:09ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982019-08-01458687010.16157/j.issn.0258-7998.19980830001074232.5D package interposer automatic design based on Allegro Package DesignZhang Cheng0Tan Lingyan1Zeng Lingyue2Globalfoundries China(Shanghai) Co. Limited，Shanghai 201204，ChinaGlobalfoundries China(Shanghai) Co. Limited，Shanghai 201204，ChinaGlobalfoundries China(Shanghai) Co. Limited，Shanghai 201204，ChinaDue to the high bandwidth characteristics of HBM(high bandwidth memory), there are a large number of HBM interface connections that need to be manually completed during the layout design of the 2.5D package interposer. This article describes how to use the SKILL language to implement automatic wiring of HBM interface in APD(Allegro package design), reducing the original manual wiring from 2 weeks to 10 minutes, saving design cycles.http://www.chinaaet.com/article/30001074232.5d advanced packagehbm(high bandwidth memory)skillapd(allegro package design)automatic wiring
collection	DOAJ
language	zho
format	Article
sources	DOAJ
author	Zhang Cheng Tan Lingyan Zeng Lingyue
spellingShingle	Zhang Cheng Tan Lingyan Zeng Lingyue 2.5D package interposer automatic design based on Allegro Package Design Dianzi Jishu Yingyong 2.5d advanced package hbm(high bandwidth memory) skill apd(allegro package design) automatic wiring
author_facet	Zhang Cheng Tan Lingyan Zeng Lingyue
author_sort	Zhang Cheng
title	2.5D package interposer automatic design based on Allegro Package Design
title_short	2.5D package interposer automatic design based on Allegro Package Design
title_full	2.5D package interposer automatic design based on Allegro Package Design
title_fullStr	2.5D package interposer automatic design based on Allegro Package Design
title_full_unstemmed	2.5D package interposer automatic design based on Allegro Package Design
title_sort	2.5d package interposer automatic design based on allegro package design
publisher	National Computer System Engineering Research Institute of China
series	Dianzi Jishu Yingyong
issn	0258-7998
publishDate	2019-08-01
description	Due to the high bandwidth characteristics of HBM(high bandwidth memory), there are a large number of HBM interface connections that need to be manually completed during the layout design of the 2.5D package interposer. This article describes how to use the SKILL language to implement automatic wiring of HBM interface in APD(Allegro package design), reducing the original manual wiring from 2 weeks to 10 minutes, saving design cycles.
topic	2.5d advanced package hbm(high bandwidth memory) skill apd(allegro package design) automatic wiring
url	http://www.chinaaet.com/article/3000107423
work_keys_str_mv	AT zhangcheng 25dpackageinterposerautomaticdesignbasedonallegropackagedesign AT tanlingyan 25dpackageinterposerautomaticdesignbasedonallegropackagedesign AT zenglingyue 25dpackageinterposerautomaticdesignbasedonallegropackagedesign
_version_	1725082932667744256

2.5D package interposer automatic design based on Allegro Package Design

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