High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays
System-in-Foil (SiF) is an emerging field of large-area polymer electronics that employs new materials such as conductive polymers and electrophoretic micro-capsules (E-Ink) along with ultra-thin and thus flexible chips. In flexible displays, the integration of gate and source drivers onto the flexi...
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Copernicus Publications
2009-05-01
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Series: | Advances in Radio Science |
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doaj-e15ae255c3e94fc18e51bbbc0bcf9ee02020-11-24T22:43:31ZdeuCopernicus PublicationsAdvances in Radio Science 1684-99651684-99732009-05-017237242High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displaysJ. N. BurghartzH. RichterA. AsifSystem-in-Foil (SiF) is an emerging field of large-area polymer electronics that employs new materials such as conductive polymers and electrophoretic micro-capsules (E-Ink) along with ultra-thin and thus flexible chips. In flexible displays, the integration of gate and source drivers onto the flexible part increases the yield and enhances the reliability of the system. <br><br> In this work we propose a high-voltage Chipfilm<sup>TM</sup> lateral diffused MOS transistor (LDMOS) structure on ultra-thin single-crystalline silicon chips. The fabrication process is compatible with CMOS standard processing. This LDMOS structure proves to be well suited for providing adequately large switching voltages in spite of the thin (<10 μm) substrate. A breakdown voltage of more than 100 volts with drain-to-source saturation current I<sub><i>ds</i>(sat)</sub>≈85 μA/μm for N-LDMOS and I<sub><i>ds</i>(sat)</sub>≈20 μA/μm for P-LDMOS is predicted through process and device simulations. http://www.adv-radio-sci.net/7/237/2009/ars-7-237-2009.pdf |
collection |
DOAJ |
language |
deu |
format |
Article |
sources |
DOAJ |
author |
J. N. Burghartz H. Richter A. Asif |
spellingShingle |
J. N. Burghartz H. Richter A. Asif High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays Advances in Radio Science |
author_facet |
J. N. Burghartz H. Richter A. Asif |
author_sort |
J. N. Burghartz |
title |
High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays |
title_short |
High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays |
title_full |
High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays |
title_fullStr |
High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays |
title_full_unstemmed |
High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays |
title_sort |
high-voltage (100 v) chipfilmtm single-crystal silicon ldmos transistor for integrated driver circuits in flexible displays |
publisher |
Copernicus Publications |
series |
Advances in Radio Science |
issn |
1684-9965 1684-9973 |
publishDate |
2009-05-01 |
description |
System-in-Foil (SiF) is an emerging field of large-area polymer electronics that employs new materials such as conductive polymers and electrophoretic micro-capsules (E-Ink) along with ultra-thin and thus flexible chips. In flexible displays, the integration of gate and source drivers onto the flexible part increases the yield and enhances the reliability of the system. <br><br> In this work we propose a high-voltage Chipfilm<sup>TM</sup> lateral diffused MOS transistor (LDMOS) structure on ultra-thin single-crystalline silicon chips. The fabrication process is compatible with CMOS standard processing. This LDMOS structure proves to be well suited for providing adequately large switching voltages in spite of the thin (<10 μm) substrate. A breakdown voltage of more than 100 volts with drain-to-source saturation current I<sub><i>ds</i>(sat)</sub>≈85 μA/μm for N-LDMOS and I<sub><i>ds</i>(sat)</sub>≈20 μA/μm for P-LDMOS is predicted through process and device simulations. |
url |
http://www.adv-radio-sci.net/7/237/2009/ars-7-237-2009.pdf |
work_keys_str_mv |
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