Removing metal debris from thermosetting EMC powders by Nd-Fe-B permanent magnets
During the preparation of thermosetting encapsulation molding compounds (EMCs) for semiconductor packaging, metal debris are always present in the EMC powders due to the hard silica fillers in the compound. These metal debris in the EMC powders will cause circuit shortage and therefore have to be re...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2017-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201713003009 |