Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material

Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material

In this study, a heat management module containing a microencapsulated phase change material (mPCM) was fabricated from mPCM (core material: paraffin; melting temperature: 37 °C) and aluminum honeycomb structures (8 mm core cell). The aluminum honeycomb functioned both as structural support...

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Bibliographic Details
Main Authors: H.M. Shih, Yi-Pin Lin, L.P. Lin, Chi-Ming Lai
Format: Article
Language:English
Published: MDPI AG 2019-06-01
Series:Energies
Subjects:
phase change material (PCM)
microencapsulated phase change material (mPCM)
heat transfer
thermal performance
Online Access:https://www.mdpi.com/1996-1073/12/11/2164

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