Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air
Ultrasonic-assisted transient liquid phase bonding of pure Cu with Sn-In solder was realized at 140°C in air. Shear test was carried out on the weldment. The effect of ultrasonic vibration on microstructure and mechanical properties of the weld seam was studied. The relationship between the formatio...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2020-10-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/1687814020966532 |