Effects of grain size on the spallation behavior of pure copper under plate-impact loading

• Main Authors: Jiang ZhaoXiu, Peng Hui, Xing MingZhi, Shen HaiTing, He HongLiang, Wang YongGang
• Format: Article
• Language: English
• Published: EDP Sciences 2015-01-01
• Series: EPJ Web of Conferences
• Online Access: http://dx.doi.org/10.1051/epjconf/20159402003

The effects of grain size on the dynamic tensile fracture (or spall) response were investigated for high purity copper materials by plate-impact experiments. The spall strength estimated from the free surface velocity profile is nearly constant with no significant effect from the grain size. However, differences are observed in the acceleration rate of velocity rebound beyond the minima. This may be attributed to the effect of grain size on the growth rate of damage. Metallographic analyses of the fracture surface show that the characteristic feature of the fracture surface clearly depends on the grain size. In the smaller samples, the fracture surfaces are decorated with large, high-density ductile dimples suggesting that the preferential failure mode is ductile intergranular fracture. In the larger samples, the fracture surfaces have a rock candy appearance with small, brittle, high density dimples as well as large ductile dimples suggesting that the fracture mode is a mix of both brittle intergranular fracture and ductile transgranular fracture.