Electrodeposition of Bi-Te Thin Films on Silicon Wafer and Micro-Column Arrays on Microporous Glass Template

Electrodeposition is an important method for preparing bismuth telluride (Bi<sub>2</sub>Te<sub>3</sub>)-based thermoelectric (TE) thin films and micro-column arrays. When the concentrations of Bi:Te in electrolytes were 3 mM:4 mM, the TE films satisfied the Bi<sub>2<...

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Bibliographic Details
Main Authors: Ning Su, Shuai Guo, Fu Li, Bo Li
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/10/3/431
Description
Summary:Electrodeposition is an important method for preparing bismuth telluride (Bi<sub>2</sub>Te<sub>3</sub>)-based thermoelectric (TE) thin films and micro-column arrays. When the concentrations of Bi:Te in electrolytes were 3 mM:4 mM, the TE films satisfied the Bi<sub>2</sub>Te<sub>3</sub> stoichiometry and had no dependence on deposition potential. With increasing over-potential, crystal grains changed from lamellar structures with uniform growth directions to large clusters with staggered dendrites, causing a decrease in the deposition density. Meanwhile, the preferred (110) orientation was diminished. The TE film deposited at &#8722;35 mV had an optimum conductivity of 2003.6 S/cm and a power factor of 2015.64 &#956;W/mK<sup>2</sup> at room temperature due to the (110)-preferred orientation. The electrodeposition of TE micro-columns in the template was recently used to fabricate high-power micro-thermoelectric generators (micro-TEG). Here, microporous glass templates were excellent templates for micro-TEG fabrication because of their low thermal conductivity, high insulation, and easy processing. A three-step pulsed-voltage deposition method was used for the fabrication of micro-columns with large aspect ratios, high filling rates, and high density. The resistance of a single TE micro-column with a 60 &#956;m diameter and a 200 &#956;m height was 6.22 &#937;. This work laid the foundation for micro-TEG fabrication and improved performance.
ISSN:2079-4991