Dynamic and Post-Dynamic Recrystallization of Haynes 282 below the Secondary Carbide Solvus

• Main Authors: Emil Eriksson, Magnus Hörnqvist Hörnqvist Colliander
• Format: Article
• Language: English
• Published: MDPI AG 2021-01-01
• Series: Metals
• Subjects: Ni-base superalloys; dynamic recrystallization; post-dynamic recrystallization; hot deformation
• Online Access: https://www.mdpi.com/2075-4701/11/1/122

Thermomechanical processes, such as forging, are important steps during manufacturing of superalloy components. The microstructural development during processing, which controls the final component properties, is complex and depends on e.g., applied strain, strain rate and temperature. In this study, we investigate the effect of process parameters on the dynamic and post-dynamic recrystallization during hot compression of Ni-base superalloy Haynes 282. Specifically, we address the effect of deformation below the grain boundary carbide solvus temperature. During deformation, discontinuous and continuous dynamic recrystallization was observed at the grain boundaries, and particle-stimulated nucleation occurred at primary carbides. Strain rate was determined to be the governing factor controlling the recrystallization fraction for strain rates up to 0.5 s<inline-formula><math display="inline"><semantics><msup><mrow></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msup></semantics></math></inline-formula> above which adiabatic heating became the dominating factor. Careful examination of the temperature development during deformation showed that the response of the closed-loop temperature control system to adiabatic heating can have important effects on the interpretation of the observed behavior. During a 90 s post-deformation hold, grain growth and an increasing fraction of twin boundaries significantly changed the deformation-induced microstructure and texture. The microstructure developed during post-dynamic recrystallization was mainly controlled by the temperature and only weakly coupled to the prior deformation step.