Method of Selecting the Operation Parameters of Electric Spindle with Aerostatic Supports for Separation of Semiconductor Plates to Crystals. Part 1. Development of a Mathematical Model of Axial Oscillations of the Electric Spindle

• Main Authors: Alexander E. Kovensky, Vladimir L. Basiniuk, Ryta E. Volkotrub
• Format: Article
• Language: English
• Published: National Academy of Sciences of Belarus, State Scientific Institution “The Joint Institute of Mechanical Engineering" 2020-09-01
• Series: Механика машин, механизмов и материалов
• Subjects: diamond disk; aerostatic bearings; crystals; vibrations; cutting; electrospindle
• Online Access: http://mmmm.by/en/readers-en/archive-room-en?layout=edit&id=1600
• ISSN: 1995-0470; 2518-1475

The article presents the results of studies of the mechanism of the occurrence of axial vibrations in the mechanical system “electrospindle shaft with aerostatic bearings – cutting diamond disk – cuttable semiconductor wafer”. A mathematical model of the resulting axial vibrations of the electrospindle shaft is proposed, taking into account the natural frequencies of mechanical vibrations of the electrospindle shaft, the working feed rate, the ratio of the axial stiffness of the diamond disk and the axial aerostatic bearings of the electrospindle shaft, the position of the peripheral surface of the semiconductor wafer relative to the direction of the working feed, and the damping properties of the mechanical system under consideration. The use of the proposed model made it possible to obtain engineering dependences, one of which have the possibility to estimate the influence of the above parameters on the deformation of the cutting diamond disk, the value of which is related to the quality of the initial section of the cut groove, the other, which arises in addition to the quasi-static, related to the axial component of the cutting force, dynamic component of the axial load, which is one of the main sources occurrence of cracks and chips of the cutting edges of diamond disks and semiconductor wafers.All of this, in aggregate, will make it possible to develop an adaptive methodology for controlling the functioning parameters of the drives, which ensures the required quality of the slot to be cut in the absence of chips and cracks in the diamond disk and semiconductor wafer.