Development of reliability assessment technique forwafer transfer robot

• Main Authors: Baek-Ju Sung, Jong-Bae Lee
• Format: Article
• Language: English
• Published: Taylor & Francis Group 2018-01-01
• Series: Journal of International Council on Electrical Engineering
• Subjects: Wafer transfer robot; repeatability; reliability assessment; failure analysis; accelerated model
• Online Access: http://dx.doi.org/10.1080/22348972.2018.1515693

Since the semiconductor manufacturing process requires high precision, performance deterioration is largely confirmed even by microscopic impact or impurities. However, it is difficult to maintain basic performance in extreme operating environments such as vacuum and high temperature. The wafer transfer robot is a precision control robot for transferring semi-finished products (wafers) from the semiconductor display production line to the next process. Since the reliability of robots is directly related to the reliability of manufactured semiconductors, this equipment must clearly detect the existence of wafers and have control precision and stability in high temperature environment. In this paper, reliability evaluation techniques such as preparation of failure analysis materials for wafer transfer robot, test items for reliability evaluation, and calculation of accelerated life test time have been proposed. Finally, main performance tests of an improved wafer transfer robot were performed.