Development of reliability assessment technique forwafer transfer robot
Since the semiconductor manufacturing process requires high precision, performance deterioration is largely confirmed even by microscopic impact or impurities. However, it is difficult to maintain basic performance in extreme operating environments such as vacuum and high temperature. The wafer tran...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2018-01-01
|
| Series: | Journal of International Council on Electrical Engineering |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/22348972.2018.1515693 |