Temperature and Dilatation Estimation for Modern Semiconductor Devices

• Main Authors: Eric JOUBERT, Olivier LATRY, Jean-Philippe ROUX
• Format: Article
• Language: English
• Published: IFSA Publishing, S.L. 2015-01-01
• Series: Sensors & Transducers
• Subjects: Thermal measurement; Laser; Electronic components.
• Online Access: http://www.sensorsportal.com/HTML/DIGEST/january_2015/Vol_184/P_2595.pdf

This paper presents a new approach for measuring physical variables on micro- electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is realized by a Michelson interferometer coupled with a Charge Coupled Device (CCD) line device. To validate this method, the temperature measurements were directly compared with the results obtained by an infrared camera and by a measurement of variation of I (V). The displacement measurements were compared with those obtained by a laser 3D vibrometer, whose physical principle is completely different. Consistent results were obtained regarding the different techniques.