Evolución microestructural de capas delgadas de cobre por flujo de corriente eléctrica aplicada

Evolución microestructural de capas delgadas de cobre por flujo de corriente eléctrica aplicada

The microstructural evolution during electrical current flow application on copper thin films was studied. The morphological analysis by atomic force microscopy (AFM), and the structural analysis by grazing incidence X-ray diffraction (XRD) were realized when an electrical current between 0 and 2.2A...

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Bibliographic Details
Main Authors: Quintana, P., Oliva, A. I., Alonzo, F., Corona, J. E., Cauich, W.
Format: Article
Language:English
Published: Elsevier 2004-08-01
Series:Boletín de la Sociedad Española de Cerámica y Vidrio
Subjects:
Copper
thin films
XRD
AFM
Auger spectroscopy
Cobre
capas delgadas
DRX
MFA
espectroscopía Auger
Online Access:http://ceramicayvidrio.revistas.csic.es/index.php/ceramicayvidrio/article/view/438/457

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http://ceramicayvidrio.revistas.csic.es/index.php/ceramicayvidrio/article/view/438/457

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